MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THERMAL TRANSFER

Embodiments described herein may be related to apparatuses, processes, and techniques related to thermal routing techniques within a hybrid silicon laser or photonics integrated circuit to facilitate heat extraction during laser operation. In particular dual metal layers, with a top metal layer ther...

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Main Authors SHAH, Hemant Mahesh, AGRAWAL, Ankur, ASPANDIAR, Raiyomand, DOBRIYAL, Priyanka, MALLIK, Aditi, CARANTO, Neil Raymund, FATHOLOLOUMI, Saeed, PRAKASH, Anna
Format Patent
LanguageEnglish
Published 29.12.2022
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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Summary:Embodiments described herein may be related to apparatuses, processes, and techniques related to thermal routing techniques within a hybrid silicon laser or photonics integrated circuit to facilitate heat extraction during laser operation. In particular dual metal layers, with a top metal layer thermally coupled with P node above a quantum well and extending substantially under a heat sink, and a bottom metal layer thermally coupled with an N node, where the top metal layer and the bottom metal layer are not electrically coupled. Other embodiments may be described and/or claimed.
Bibliography:Application Number: US202117357938