PHOTONIC INTEGRATED CIRCUIT COOLING WITH A THERMAL DIE

Embodiments described herein may be related to apparatuses, processes, and techniques related to thermally and/or electrically coupling a thermal die to the surface of a photonic integrated circuit (PIC) within an open cavity in a substrate, where the thermal die is proximate to a laser on the PIC....

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Bibliographic Details
Main Authors KARHADE, Omkar, ACIKALIN, Tolga, CHIU, Chia-Pin, GUJJULA, Sushrutha Reddy, MAHAJAN, Ravindranath V, JAUSSI, James E
Format Patent
LanguageEnglish
Published 29.12.2022
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:Embodiments described herein may be related to apparatuses, processes, and techniques related to thermally and/or electrically coupling a thermal die to the surface of a photonic integrated circuit (PIC) within an open cavity in a substrate, where the thermal die is proximate to a laser on the PIC. Other embodiments may be described and/or claimed.
Bibliography:Application Number: US202117358502