DIE PACKAGE HAVING SECURITY FEATURES

Methods and apparatus for providing an assembly including a base substrate, a lid substrate, and a ring frame between the base substrate and the lid substrate to define a protected volume, where the ring frame includes through vias. A die may be contained in the protected volume. Sensor circuitry ca...

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Bibliographic Details
Main Authors George, Aaron, Kehl, Jason M, Milne, Jason G, Mayrose, Steve F
Format Patent
LanguageEnglish
Published 15.12.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Methods and apparatus for providing an assembly including a base substrate, a lid substrate, and a ring frame between the base substrate and the lid substrate to define a protected volume, where the ring frame includes through vias. A die may be contained in the protected volume. Sensor circuitry can include conductive pillars in the protected volume and the die can include circuity to determine an impedance of the pad and the pillars for tamper detection. An edge cap can be coupled to at least one side of the assembly for tamper detection.
Bibliography:Application Number: US202117345518