ELECTRONIC ASSEMBLY HAVING MULTIPLE SUBSTRATE SEGMENTS

An electronic assembly includes a mechanical carrier, a plurality of integrated circuits disposed on the mechanical carrier, a fan out package disposed on the plurality of integrated circuits, a plurality of singulated substrates disposed on the fan out package, a plurality of electronic components...

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Bibliographic Details
Main Authors Pang, Mengzhi, Sun, Shishuang, Venkataramanan, Ganesh
Format Patent
LanguageEnglish
Published 08.12.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic assembly includes a mechanical carrier, a plurality of integrated circuits disposed on the mechanical carrier, a fan out package disposed on the plurality of integrated circuits, a plurality of singulated substrates disposed on the fan out package, a plurality of electronic components disposed on the plurality of singulated substrates, and at least one stiffness ring disposed on the plurality of singulated substrates. A method for constructing an electronic assembly includes identifying a group of known good singulated substrates, joining the group of known good singulated substrates into a substrate panel, attaching at least one bridge to the substrate panel that electrically couples at least two of the known good singulated substrates, and mounting a plurality of electronic components onto the substrate panel, each electronic component of the plurality of electronic components corresponding to a respective known good singulated substrate.
Bibliography:Application Number: US202217807475