METHOD FOR SELECTIVELY IRRADIATING A POWDER LAYER IN ADDITIVE MANUFACTURING WITH A FIRST AND A SECOND IRRADIATION PATTERN
A method for selectively irradiating a powder layer in additive manufacturing of a component. The method including: determining an irradiation pattern of the layer for additive manufacturing, wherein a first partial pattern is defined which is intended for continuous irradiation and comprises a plur...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
08.12.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A method for selectively irradiating a powder layer in additive manufacturing of a component. The method including: determining an irradiation pattern of the layer for additive manufacturing, wherein a first partial pattern is defined which is intended for continuous irradiation and comprises a plurality of irradiation vectors and wherein a second partial pattern is defined, which is intended for a pulsed irradiation, with the first and the second partial pattern being selected in such a manner that the second partial pattern connects irradiation vectors of the first partial pattern, and irradiating the layer in accordance with the irradiation patterns defined. A computer program product, an irradiating device, and a control unit for controlling an irradiating device are included. |
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Bibliography: | Application Number: US202017775282 |