CHIP PACKAGE STRUCTURE WITH RING STRUCTURE

A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a first chip structure and a second chip structure over the wiring substrate. The first chip structure is spaced apart from the second chip structure by a gap. The chip p...

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Bibliographic Details
Main Authors LIN, Po-Yao, LEE, Kuang-Chun, LAI, Po-Chen, YEH, Shu-Shen, WANG, Chin-Hua, LIN, Yi Hang, JENG, Shin-Puu, YANG, Che-Chia
Format Patent
LanguageEnglish
Published 01.12.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a first chip structure and a second chip structure over the wiring substrate. The first chip structure is spaced apart from the second chip structure by a gap. The chip package structure includes a ring structure over the wiring substrate. The ring structure has a first opening, the first chip structure and the second chip structure are in the first opening, the first opening has a first inner wall, the first inner wall has a first recess, and the gap extends toward the first recess.
Bibliography:Application Number: US202217818432