THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF

• Main Authors: MARUYAMA, Narimi, YAMADA, Kunihiro
• Format: Patent
• Language: English
• Published: 01.12.2022
• Subjects: ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Provided is a thermally conductive silicone composition whose cured product exhibits no cracks and voids, and has a favorable thermal conductivity. The thermally conductive silicone composition contains:(A) an organopolysiloxane having at least two silicon atom-bonded aliphatic unsaturated hydrocarbon groups per each molecule, and having a kinetic viscosity of 10 to 1,000,000 mm2/s at 25° C.;(B) an organohydrogenpolysiloxane;(C) gallium and/or a gallium alloy that have a melting point of −20 to 70° C.;(D) a thermally conductive filler having an average particle size of 0.1 to 100 pin;(E) a platinum group metal catalyst;(F) a palladium powder; and(G-1) an organopolysiloxane represented by the following general formula (1):wherein R1 independently represents an aliphatic unsaturated bond-free substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; R2 independently represents an alkyl group, an alkenyl group or an acyl group.