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A metal substrate supported by a wiring substrate includes a movable portion, a first extending portion, a first coupling portion that couples the first extending portion and the movable portion, and a first connection portion connected to the first extending portion. The first connection portion in...

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Bibliographic Details
Main Authors SUZUKI, Daiki, SUGIZAKI, Kota, NOZAKI, Makoto, OSAKI, Takuma
Format Patent
LanguageEnglish
Published 17.11.2022
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Summary:A metal substrate supported by a wiring substrate includes a movable portion, a first extending portion, a first coupling portion that couples the first extending portion and the movable portion, and a first connection portion connected to the first extending portion. The first connection portion includes a first fixing region fixed to the wiring substrate, and a first connection region connected to the first extending portion and to the first fixing region. The first connection region includes a first bent portion. The first bent portion has a first outer edge on a movable portion side, and a second outer edge opposite the movable portion, and each of the first outer edge and the second outer edge is bent toward the movable portion side when viewed in a Z-axis direction.
Bibliography:Application Number: US202217736161