Pop-Up Laminate Structures with Integrated Electronics

• Main Authors: Smith, Michael J, Wood, Robert J, Dubrovsky, Zivthan, Gafford, Joshua B, O'Donnell, Kathleen, Goldberg, Benjamin I, Kesner, Samuel B, Walsh, Conor J, Karpelson, Michael
• Format: Patent
• Language: English
• Published: 17.11.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DIAGNOSIS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEDICAL OR VETERINARY SCIENCE; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; SURGERY; TRANSPORTING

A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.