SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS AND RELATED METHODS OF MANUFACTURING

A method of attaching a metal clip to a semiconductor die includes: aligning a first bonding region of the metal clip with a first bond pad of the semiconductor die; and while the first bonding region of the metal clip is aligned with the first bond pad of the semiconductor die, forming a plurality...

Full description

Saved in:
Bibliographic Details
Main Authors Del Rosario, Joel Feliciano, Hashim, Mohd Afiz, Hiew, Mei Fen, Gan, Thai Kee, Bajuri, Mohd Kahar
Format Patent
LanguageEnglish
Published 03.11.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A method of attaching a metal clip to a semiconductor die includes: aligning a first bonding region of the metal clip with a first bond pad of the semiconductor die; and while the first bonding region of the metal clip is aligned with the first bond pad of the semiconductor die, forming a plurality of first wire bonds to the first bond pad of the semiconductor die through a plurality of openings in the first bonding region of the metal clip, the plurality of first wire bonds forming a joint between the metal clip and the first bond pad of the semiconductor die. Additional methods and related semiconductor packages produced from such methods are also described.
Bibliography:Application Number: US202117243056