ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE

The present disclosure provides an electronic assembly including a semiconductor device package. The semiconductor device package includes a first package and a conductive element. The first package includes an electronic component and a protection layer covering the electronic component. The conduc...

Full description

Saved in:
Bibliographic Details
Main Authors YEH, Chang-Lin, KAO, Jen-Chieh
Format Patent
LanguageEnglish
Published 27.10.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The present disclosure provides an electronic assembly including a semiconductor device package. The semiconductor device package includes a first package and a conductive element. The first package includes an electronic component and a protection layer covering the electronic component. The conductive element is supported by the protection layer and electrically connected with the electronic component through an electrical contact. A method for manufacturing a semiconductor device package is also provided in the present disclosure.
Bibliography:Application Number: US202117239482