COMBINED ON-PACKAGE AND OFF-PACKAGE MEMORY SYSTEM

A combined on-package and off-package memory system uses a custom base-layer within which are fabricated one or more dedicated interfaces to off-package memories. An on-package processor and on-package memories are also directly coupled to the custom base-layer. The custom base-layer includes memory...

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Bibliographic Details
Main Authors Chatterjee, Niladrish, Uttreja, Gaurav, O'Connor, James Michael, Lee, Donghyuk, Gandhi, Wishwesh Anil
Format Patent
LanguageEnglish
Published 27.10.2022
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:A combined on-package and off-package memory system uses a custom base-layer within which are fabricated one or more dedicated interfaces to off-package memories. An on-package processor and on-package memories are also directly coupled to the custom base-layer. The custom base-layer includes memory management logic between the processor and memories (both off and on package) to steer requests. The memories are exposed as a combined memory space having greater bandwidth and capacity compared with either the off-package memories or the on-package memories alone. The memory management logic services requests while maintaining quality of service (QoS) to satisfy bandwidth requirements for each allocation. An allocation may include any combination of the on and/or off package memories. The memory management logic also manages data migration between the on and off package memories.
Bibliography:Application Number: US202117237165