SEMICONDUCTOR DEVICE AND DISPLAY DEVICE

The present disclosure provides a semiconductor device, including a buffer layer, a first sub-chip and a second sub-chip, and a connecting element. The first sub-chip and the second sub-chip are separately arranged on the buffer layer. Each of the first sub-chip and the second sub-chip includes a fi...

Full description

Saved in:
Bibliographic Details
Main Authors HSIEH, Chia-Ting, LIN, Hsin-Ying, WU, Yang-En, LEE, June-Woo, YEH, Cheng-Nan, LIN, Yu-Chieh, HUANG, Chien-Fu, LAN, Yung-Hsiang, SU, Sung-Yu, WANG, Ya-Jung, LEE, Seok-Lyul, WANG, Hsien-Chun
Format Patent
LanguageEnglish
Published 20.10.2022
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The present disclosure provides a semiconductor device, including a buffer layer, a first sub-chip and a second sub-chip, and a connecting element. The first sub-chip and the second sub-chip are separately arranged on the buffer layer. Each of the first sub-chip and the second sub-chip includes a first diffusion layer, an active layer, and a second diffusion layer. The first diffusion layer, the active layer, and the second diffusion layer are sequentially arranged on the buffer layer in a top-down approach. The first diffusion layer and the buffer layer are first-type epitaxial layers, and the second diffusion layer is a second-type epitaxial layer. The connecting element is configured to couple the second diffusion layer of the first sub-chip and the first diffusion layer of the second sub-chip.
Bibliography:Application Number: US202217721640