MULTIPLE FUNCTION BLOCKS ON A SYSTEM ON A CHIP (SOC)

• Main Authors: NALLAPATI, Giridhar, BAO, Junjing, ZHU, John Jianhong
• Format: Patent
• Language: English
• Published: 20.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In an aspect, a system on a chip (SOC) includes a plurality of function blocks, including a first function block and a second function block, co-located on the SOC. The SOC includes a first metal layer, a first dielectric layer located on top of the first metal layer, and a first via located in the first dielectric layer and used in the first function block. The SOC includes a second via located in the first dielectric layer and used in the second function block and a second metal layer located on the first dielectric layer. The second metal layer comprises a first set of connections used in the first function block and a second set of connections used in the second function block. The first set of connections is different from the second set of connections. The SOC includes a second dielectric layer located on the first dielectric layer.