SUBSTRATE HANDLING DEVICE AND PROCESSING CHAMBER

A substrate handling device includes a substrate reception area defined by an edge. The substrate reception area includes a planar surface, wherein the edge extends upward from the planar surface. The substrate reception area further includes a plurality of contact structures extending upwards from...

Full description

Saved in:
Bibliographic Details
Main Authors CHOU, You-Hua, CHUANG, Kuo-Sheng
Format Patent
LanguageEnglish
Published 20.10.2022
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A substrate handling device includes a substrate reception area defined by an edge. The substrate reception area includes a planar surface, wherein the edge extends upward from the planar surface. The substrate reception area further includes a plurality of contact structures extending upwards from the planar surface, wherein a first contact structure of the plurality of contact structures directly contacts a side surface of the edge, a second contact structure of the plurality of contact structures separated from the edge, a shape of the first contact structure is different from a shape of the second contact structure. The substrate reception area and the planar surface include a first material. Each contact structure of the plurality of contact structures includes a second material different from the first material, and the second material has a hardness aligned to a hardness of a substrate material.
Bibliography:Application Number: US202217835921