MEMORY CHIP HAVING ON-DIE MIRRORING FUNCTION AND METHOD FOR TESTING THE SAME

A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting th...

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Bibliographic Details
Main Authors Jung, Hwajin, Lee, Hokyong, KIM, Byoungsul, Choi, Yongjoo
Format Patent
LanguageEnglish
Published 13.10.2022
Subjects
INFORMATION STORAGE
PHYSICS
STATIC STORES
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Summary:A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting the memory chip to a mirroring mode through a fusing operation when the EDS test, the package test, the module test or the mounting test is failed.
Bibliography:Application Number: US202217851255