NERVE CUFF ELECTRODES FABRICATED USING OVER-MOLDED LCP SUBSTRATES

An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on t...

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Bibliographic Details
Main Authors Schmidt, Siegmar, Ng, Boon Khai
Format Patent
LanguageEnglish
Published 13.10.2022
Subjects
ELECTROTHERAPY
HUMAN NECESSITIES
HYGIENE
MAGNETOTHERAPY
MEDICAL OR VETERINARY SCIENCE
RADIATION THERAPY
ULTRASOUND THERAPY
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Summary:An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into a three-dimensional structure. The flexible circuit may further include an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion, a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad, and a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad. The electrode lead may further comprise a lead connector that incorporates the connector substrate portion.
Bibliography:Application Number: US202217807370