MULTILAYER CIRCUIT BOARD

A multilayer circuit board includes a plurality of electrically conductive rear pads for termination of a plurality of wires and a plurality of electrically conductive front pads for insertion into a connector. A plurality of pairs of substantially parallel traces extend between and connect the fron...

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Bibliographic Details
Main Authors Lee, Kok Hoe, Bandhu, Saujit, Tan, Vincent, Qiao, YunLong
Format Patent
LanguageEnglish
Published 22.09.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A multilayer circuit board includes a plurality of electrically conductive rear pads for termination of a plurality of wires and a plurality of electrically conductive front pads for insertion into a connector. A plurality of pairs of substantially parallel traces extend between and connect the front pads to the rear pads. At least a first pair of traces and the front and rear pads connected thereto are disposed in a same layer of the multilayer circuit board. At least a second pair of traces is disposed in a same layer, and the rear and front pads connected thereto are disposed in a different layer of the multilayer circuit board. At least a third pair of traces are disposed in different layers of the multilayer circuit board. For each trace extending between and connecting the front and rear pads corresponding to the trace, the trace comprises no more than two vias.
Bibliography:Application Number: US202017596053