Micro LED chip, display panel and method for welding micro LED chip

The present disclosure relates to a Micro LED chip, a display panel and a method for welding the Micro LED chip. The Micro LED chip includes an N-type semiconductor layer, a P-type semiconductor layer, an N-type electrode and a P-type electrode, wherein the N-type electrode is arranged on the N-type...

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Bibliographic Details
Main Author CHEN, CHINGUNG
Format Patent
LanguageEnglish
Published 22.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure relates to a Micro LED chip, a display panel and a method for welding the Micro LED chip. The Micro LED chip includes an N-type semiconductor layer, a P-type semiconductor layer, an N-type electrode and a P-type electrode, wherein the N-type electrode is arranged on the N-type semiconductor layer, and the P-type electrode is arranged on the P-type semiconductor layer; the N-type electrode includes a first path, the first path penetrating the N-type electrode; and the P-type electrode includes a second path, the second path penetrating the P-type electrode.
Bibliography:Application Number: US201917058660