ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE
An electronic component-embedded substrate includes a core layer, a first cavity formed in the core layer, a heat dissipating member disposed in the first cavity and having a second cavity, and an electronic component disposed in the second cavity. The heat dissipating member includes a carbon fiber...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
22.09.2022
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Subjects | |
Online Access | Get full text |
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Summary: | An electronic component-embedded substrate includes a core layer, a first cavity formed in the core layer, a heat dissipating member disposed in the first cavity and having a second cavity, and an electronic component disposed in the second cavity. The heat dissipating member includes a carbon fiber reinforced polymer (CFRP). |
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Bibliography: | Application Number: US202117339451 |