HIGH-DENSITY CAPACITIVE DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE

A method for manufacturing a capacitive device comprising the following steps: a) providing a metallic layer, b) depositing a full-sheet aluminium layer, c) structuring pores in the aluminium layer by a full-sheet anodic etching process, subsequently to which a continuous porous alumina layer is obt...

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Bibliographic Details
Main Authors Claret, Thierry, Lefevre, Aude, Ferreira, Delphine
Format Patent
LanguageEnglish
Published 22.09.2022
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Summary:A method for manufacturing a capacitive device comprising the following steps: a) providing a metallic layer, b) depositing a full-sheet aluminium layer, c) structuring pores in the aluminium layer by a full-sheet anodic etching process, subsequently to which a continuous porous alumina layer is obtained comprising a first main face and a second main face, longitudinal pores extending from the first main face to the second main face, d) forming a capacitive area at a first area of the porous alumina layer, e) forming an upper electrode over the capacitive area, f) forming a contact resumption at a second area of the porous alumina layer, g) forming a lower electrode over the contact resumption.
Bibliography:Application Number: US202217655080