METHOD AND APPARATUS FOR FORMING HOLES IN BRITTLE MATERIALS ASSISTED BY STRESS REDUCTION THROUGH HEATING

A method of making a brittle substrate comprising the steps of: (i) heating at least a portion of the substrate at least to the depth d to a temperature Tp that is above 500° C., but below 1500° C., to form a heated area of the substrate; and (ii) irradiating at least a portion of the heated area of...

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Bibliographic Details
Main Authors Becker, Alejandro Antonio, Abramov, Anatoli Anatolyevich
Format Patent
LanguageEnglish
Published 15.09.2022
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A method of making a brittle substrate comprising the steps of: (i) heating at least a portion of the substrate at least to the depth d to a temperature Tp that is above 500° C., but below 1500° C., to form a heated area of the substrate; and (ii) irradiating at least a portion of the heated area of the brittle substrate with a laser beam emitted from an IR laser to form at least one hole in the brittle substrate.
Bibliography:Application Number: US202017637513