Systems and Methods for Inspection of IC Devices

In an approach to non-destructive inspection of IC devices, one or more images of a Device Under Test (DUT) are received from one or more imaging devices. Observed features are detected in the one or more images and producing a first synthetic representation of a part design of the DUT that includes...

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Bibliographic Details
Main Authors Schley, Jeremiah, Darby, Nicholas, Bellay, Jeremy
Format Patent
LanguageEnglish
Published 08.09.2022
Subjects
CALCULATING
COMPUTING
COUNTING
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
PHYSICS
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Summary:In an approach to non-destructive inspection of IC devices, one or more images of a Device Under Test (DUT) are received from one or more imaging devices. Observed features are detected in the one or more images and producing a first synthetic representation of a part design of the DUT that includes the observed features. The presence of one or more first unobserved features are inferred, where the one or more first unobserved features are inferred using a mapping and inference model (MIM). The one or more first unobserved features are added to the first synthetic representation of the part design of the DUT.
Bibliography:Application Number: US202217685837