THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING

An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, u...

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Bibliographic Details
Main Authors ERICKSON, Ashley J.M, RAZDAN, Sandeep, PETERNEL, Joyce J. M, TRAVERSO, Matthew J, PRASAD, Aparna R
Format Patent
LanguageEnglish
Published 01.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.
Bibliography:Application Number: US202217663072