METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE

Provided here are: a mounting member having a front surface on which a diffusion bonding layer is formed; an optical semiconductor element provided with a light emitting part therein, and having a rear surface on which a diffusion bonding layer is formed; and an electrode layer formed from the diffu...

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Bibliographic Details
Main Author NEGISHI, Masato
Format Patent
LanguageEnglish
Published 25.08.2022
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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Summary:Provided here are: a mounting member having a front surface on which a diffusion bonding layer is formed; an optical semiconductor element provided with a light emitting part therein, and having a rear surface on which a diffusion bonding layer is formed; and an electrode layer formed from the diffusion bonding layer and the diffusion bonding layer by diffusion bonding therebetween; wherein, in the optical semiconductor element, the light emitting part is provided near a side of the optical semiconductor element so as to be displaced toward the mounting member. This configuration not only makes unnecessary the use of a solder, an Ag paste and the like to thereby prevent the light emitting part in the optical semiconductor element from being contaminated by the solder, but also allows the light emitting part to be closer to the mounting member-side to thereby achieve improvement in heat-dissipation capability.
Bibliography:Application Number: US202017625152