SOLID-STATE IMAGE PICKUP DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE

• Main Author: MIYATA, SATOE
• Format: Patent
• Language: English
• Published: 25.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided are a solid-state image pickup device capable of improving heat dissipation property, and an electronic apparatus including the solid-state image pickup device. A solid-state image pickup device according to the present technology includes: at least one photoelectric converter formed in a semiconductor substrate; and a thermal conductive layer that is arranged on one surface side and/or another surface side of the semiconductor substrate and includes a material having a thermal conductivity higher than that of SiO2. In the solid-state image pickup device according to the present technology, the heat generated, for example, in the at least one photoelectric converter is conveyed to the thermal conductive layer. At least a part of the heat transferred to the thermal conductive layer moves toward the end surface of the thermal conductive layer along the thermal conductive layer in the thermal conductive layer and is released from the end surface to the outside.