DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a first die disposed over the substrate, a metal wire attached to a frontside of the first die, and a first plurality of die stopper bumps disposed along a backside of the first die and configured...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
25.08.2022
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Subjects | |
Online Access | Get full text |
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Summary: | In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a first die disposed over the substrate, a metal wire attached to a frontside of the first die, and a first plurality of die stopper bumps disposed along a backside of the first die and configured to control an angle of operation of the first die. The first plurality of die stopper bumps directly contacts a backside surface of the first die. |
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Bibliography: | Application Number: US202117184924 |