SOLDERED PRODUCT MANUFACTURING DEVICE AND METHOD FOR MANUFACTURING SOLDERED PRODUCT

A soldered product manufacturing device 1 includes a stage 13 on which a substrate W is placed, solder being arranged on the substrate W; a cover 16 configured to cover at least an upper part of the substrate W placed on the stage 13 at a predetermined distance therefrom; a chamber 11 configured to...

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Bibliographic Details
Main Authors MARUYAMA, Megu, NAGAHAMA, Masanobu, MATSUDA, Jun, OZAWA, Naoto, SUZUKI, Takayuki
Format Patent
LanguageEnglish
Published 25.08.2022
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Summary:A soldered product manufacturing device 1 includes a stage 13 on which a substrate W is placed, solder being arranged on the substrate W; a cover 16 configured to cover at least an upper part of the substrate W placed on the stage 13 at a predetermined distance therefrom; a chamber 11 configured to house the stage 13 and the cover 16; a heater 15 configured to heat the substrate W on the stage 13; and a reducing gas supply device 19 configured to supply a reducing gas F. A method for manufacturing a soldered product includes, by using the soldered product manufacturing device 1, placing the substrate W on the stage 13; covering the substrate W placed on the stage 13 with the cover 16; heating the substrate W; and supplying the reducing gas F into the chamber 11.
Bibliography:Application Number: US202017627100