SUBSTRATE TEMPERATURE NON-UNIFORMITY REDUCTION OVER TARGET LIFE USING SPACING COMPENSATION
Methods and apparatus for processing a plurality of substrates are provided herein. In some embodiments, a method of processing a plurality of substrates in a physical vapor deposition (PVD) chamber includes: performing a series of reflow processes on a corresponding series of substrates over at lea...
Saved in:
Main Authors | , , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
18.08.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Methods and apparatus for processing a plurality of substrates are provided herein. In some embodiments, a method of processing a plurality of substrates in a physical vapor deposition (PVD) chamber includes: performing a series of reflow processes on a corresponding series of substrates over at least a portion of a life of a sputtering target disposed in the PVD chamber, wherein a substrate-to-target distance in the PVD chamber and a support-to-target distance within the PVD chamber are each controlled as a function of the life of the sputtering target. |
---|---|
Bibliography: | Application Number: US202117177875 |