BALL BOND IMPEDANCE MATCHING
Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selecte...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
11.08.2022
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Subjects | |
Online Access | Get full text |
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Summary: | Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized. |
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Bibliography: | Application Number: US202117169098 |