METHOD AND APPARATUS TO USE ACTIVE SEMICONDUCTOR INTERPOSERS FOR RF SIGNAL CHAIN IN MODULAR STACKED INTEGRATED CIRCUITS

Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.

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Bibliographic Details
Main Authors Nasrullah, Jawad, Wang, Hanfeng, Mahmoud, Mohamed Sameh, Alnaggar, Omar
Format Patent
LanguageEnglish
Published 28.07.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
TRANSMISSION
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Summary:Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.
Bibliography:Application Number: US202217658981