BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE
A device includes a first substrate. The device also includes a barrier structure including a metallic layer on the first substrate, where the barrier structure forms a cavity. The device also includes a second substrate on the metallic layer, where the metallic layer extends between the first subst...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
07.07.2022
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Subjects | |
Online Access | Get full text |
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