BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE

A device includes a first substrate. The device also includes a barrier structure including a metallic layer on the first substrate, where the barrier structure forms a cavity. The device also includes a second substrate on the metallic layer, where the metallic layer extends between the first subst...

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Bibliographic Details
Main Authors SCHUCK, Kathryn Anne, TAYLOR, Kelly Jay, ROBY, Mary Alyssa Drummond, JACOBS, Simon Joshua, HOLM, Jennifer Lynne
Format Patent
LanguageEnglish
Published 07.07.2022
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PERFORMING OPERATIONS
PHYSICS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:A device includes a first substrate. The device also includes a barrier structure including a metallic layer on the first substrate, where the barrier structure forms a cavity. The device also includes a second substrate on the metallic layer, where the metallic layer extends between the first substrate and the second substrate, and where the metallic layer includes a sloped edge that contacts the first substrate within the cavity.
Bibliography:Application Number: US202117363710