BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE
A device includes a first substrate. The device also includes a barrier structure including a metallic layer on the first substrate, where the barrier structure forms a cavity. The device also includes a second substrate on the metallic layer, where the metallic layer extends between the first subst...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
07.07.2022
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Subjects | |
Online Access | Get full text |
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Abstract | A device includes a first substrate. The device also includes a barrier structure including a metallic layer on the first substrate, where the barrier structure forms a cavity. The device also includes a second substrate on the metallic layer, where the metallic layer extends between the first substrate and the second substrate, and where the metallic layer includes a sloped edge that contacts the first substrate within the cavity. |
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AbstractList | A device includes a first substrate. The device also includes a barrier structure including a metallic layer on the first substrate, where the barrier structure forms a cavity. The device also includes a second substrate on the metallic layer, where the metallic layer extends between the first substrate and the second substrate, and where the metallic layer includes a sloped edge that contacts the first substrate within the cavity. |
Author | HOLM, Jennifer Lynne ROBY, Mary Alyssa Drummond JACOBS, Simon Joshua SCHUCK, Kathryn Anne TAYLOR, Kelly Jay |
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Snippet | A device includes a first substrate. The device also includes a barrier structure including a metallic layer on the first substrate, where the barrier... |
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SubjectTerms | MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING |
Title | BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE |
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