HYDROGEL TIE LAYER

The disclosure relates to articles and components thereof, including outsoles, which can be used in conditions normally conducive to the accumulation of soil. In particular, the articles have substrate body, a tie layer secured to the substrate body, and a material including a hydrogel secured to th...

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Main Authors DYER, CALEB W, MAURER, MYRON, WRIGHT, ZACHARY C, BAGHDADI, HOSSEIN A, SCHILLER, DENIS, WALKER, JEREMY D, WATKINS, RICHARD L, CONSTANTINOU, JAY
Format Patent
LanguageEnglish
Published 07.07.2022
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Summary:The disclosure relates to articles and components thereof, including outsoles, which can be used in conditions normally conducive to the accumulation of soil. In particular, the articles have substrate body, a tie layer secured to the substrate body, and a material including a hydrogel secured to the tie layer. The material can prevent or reduce the accumulation of soil during use. The presence of the tie layer can minimize or prevent delamination of the hydrogel containing material during normal use.
Bibliography:Application Number: US201916679943