ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly...

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Main Authors HEATON, Thomas, BOYAPATI, Sri Ranga Sai, HAN, Jung Kyu, TANAKA, Hiroki, PIETAMBARAM, Srinivas V, DARMAWIKARTA, Kristof, MAY, Robert Alan, LEHAF, Ali, CHO, Steve
Format Patent
LanguageEnglish
Published 23.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.
Bibliography:Application Number: US202217690964