STRUCTURAL THERMAL INTERFACING FOR LIDDED SEMICONDUCTOR PACKAGES

Structural thermal interfacing for lidded semiconductor packages, including: applying, to a periphery of a surface of a chip, a stiffening adhesive framing a center portion of the chip; applying, to the center portion of the chip, a thermal interface material; and applying a lid to the chip, wherein...

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Bibliographic Details
Main Authors SWAMINATHAN, RAJA, WILKERSON, BRETT P, SHAH, PRIYAL
Format Patent
LanguageEnglish
Published 23.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Structural thermal interfacing for lidded semiconductor packages, including: applying, to a periphery of a surface of a chip, a stiffening adhesive framing a center portion of the chip; applying, to the center portion of the chip, a thermal interface material; and applying a lid to the chip, wherein the lid contacts the stiffening adhesive and is thermally coupled to the chip via the thermal interface material after application to the chip.
Bibliography:Application Number: US202117554498