APPARATUS FOR POST EXPOSURE BAKE OF PHOTORESIST
A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include a chamber body, which is configured to be filled with a process fluid, and a substr...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
23.06.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include a chamber body, which is configured to be filled with a process fluid, and a substrate carrier. The substrate carrier is disposed outside of the process volume while substrates are loaded onto the substrate carrier, but is rotated to a processing position either simultaneously or before entering the process fluid. The substrate carrier is rotated to a process position parallel to an electrode before an electric field is utilized to perform a post-exposure bake process on the substrate. |
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Bibliography: | Application Number: US202017126797 |