ADHESION PROMOTING PHOTORESIST UNDERLAYER COMPOSITION
A photoresist underlayer composition comprising a poly(arylene ether); an additive of formula (14):D-(L1-Ar-[X]n)m (14); anda solvent, wherein, in formula (14), D is a substituted or unsubstituted C1-60 organic group, optionally wherein D is an organic acid salt of the substituted or unsubstituted...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
23.06.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A photoresist underlayer composition comprising a poly(arylene ether); an additive of formula (14):D-(L1-Ar-[X]n)m (14); anda solvent, wherein, in formula (14), D is a substituted or unsubstituted C1-60 organic group, optionally wherein D is an organic acid salt of the substituted or unsubstituted C1-60 organic group; each L1 is independently a single bond or a divalent linking group, when L1 is a single bond, D may be a substituted or unsubstituted C3-30 cycloalkyl or substituted or unsubstituted C1-20 heterocycloalkyl that is optionally fused with Ar, each Ar is independently a monocyclic or polycyclic C5-60 aromatic group, each X is independently -OR30, -SR31, or -NR32R33, m is an integer of 1 to 6, each n is independently an integer of 0 to 5, provided that a sum of all n is 2 or greater, and R30 to R33 are as provided herein. |
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Bibliography: | Application Number: US202017127434 |