ADAPTIVE SLURRY DISPENSE SYSTEM

Provided herein are advanced substrate polishing methods that use a machine-learning artificial intelligence (AI) algorithm, or a software application generated using the AI, to control one or more aspects of the polishing process. The AI algorithm is trained to simulate a polishing process and to m...

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Bibliographic Details
Main Authors DESHPANDE, Sameer, HUEY, Sidney P, WITTY, Derek R
Format Patent
LanguageEnglish
Published 23.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS
COMPUTING
COUNTING
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
HANDLING RECORD CARRIERS
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
PHYSICS
POLISHING
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:Provided herein are advanced substrate polishing methods that use a machine-learning artificial intelligence (AI) algorithm, or a software application generated using the AI, to control one or more aspects of the polishing process. The AI algorithm is trained to simulate a polishing process and to make predictions about the polishing process and process results expected therefrom, using substrate processing data acquired from a polishing system.
Bibliography:Application Number: US202117554596