DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME

• Main Authors: Kang, Unbyoung, Hong, Jiseok, Park, Sangcheon, Kang, Myungsung, Lee, Hyuekjae, Hwang, Jihwan, Kim, Taehun
• Format: Patent
• Language: English
• Published: 09.06.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding pad formed on the first test pad, and a first insulating layer, the first bonding pad penetrates the first insulating layer. The structure may...