DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME

According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding pad formed on the first test pad, and a first insulating layer, the first bonding pad penetrates the first insulating layer. The structure may...

Full description

Saved in:
Bibliographic Details
Main Authors Kang, Unbyoung, Hong, Jiseok, Park, Sangcheon, Kang, Myungsung, Lee, Hyuekjae, Hwang, Jihwan, Kim, Taehun
Format Patent
LanguageEnglish
Published 09.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Abstract According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding pad formed on the first test pad, and a first insulating layer, the first bonding pad penetrates the first insulating layer. The structure may further include a wafer having a second test pad, a second bonding pad formed on the second test pad, and a second insulating layer, the second bonding pad penetrates the second insulating layer. The structure may further include a polymer layer surrounding all side surfaces of the first bonding pad and all side surfaces of the second bonding pad, the polymer layer being arranged between the die and the wafer. Additionally, the wafer and the die may be bonded together.
AbstractList According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding pad formed on the first test pad, and a first insulating layer, the first bonding pad penetrates the first insulating layer. The structure may further include a wafer having a second test pad, a second bonding pad formed on the second test pad, and a second insulating layer, the second bonding pad penetrates the second insulating layer. The structure may further include a polymer layer surrounding all side surfaces of the first bonding pad and all side surfaces of the second bonding pad, the polymer layer being arranged between the die and the wafer. Additionally, the wafer and the die may be bonded together.
Author Hong, Jiseok
Kim, Taehun
Lee, Hyuekjae
Park, Sangcheon
Kang, Unbyoung
Kang, Myungsung
Hwang, Jihwan
Author_xml – fullname: Kang, Unbyoung
– fullname: Hong, Jiseok
– fullname: Park, Sangcheon
– fullname: Kang, Myungsung
– fullname: Lee, Hyuekjae
– fullname: Hwang, Jihwan
– fullname: Kim, Taehun
BookMark eNrjYmDJy89L5WRwd_F01Q3x1w13dHMNUnDy93Px9HNXCA4JCnUOCQ1yVXD0c1EIdvX1dAbKAIX8gxQCHJ29Hd1dFUKDQSpDPFwVgh19XXkYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXxosJGBkZGhhaGRhamjoTFxqgClBy8f
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2022181285A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2022181285A13
IEDL.DBID EVB
IngestDate Fri Jul 19 12:45:57 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2022181285A13
Notes Application Number: US202217680477
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220609&DB=EPODOC&CC=US&NR=2022181285A1
ParticipantIDs epo_espacenet_US2022181285A1
PublicationCentury 2000
PublicationDate 20220609
PublicationDateYYYYMMDD 2022-06-09
PublicationDate_xml – month: 06
  year: 2022
  text: 20220609
  day: 09
PublicationDecade 2020
PublicationYear 2022
RelatedCompanies Samsung Electronics Co., Ltd
RelatedCompanies_xml – name: Samsung Electronics Co., Ltd
Score 3.4106207
Snippet According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220609&DB=EPODOC&locale=&CC=US&NR=2022181285A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NS8MwFH-MKepNp-J0SkDpLbimXbcehnRp2qmsHf3Q3Ua7dSBIN1zFf9-XsOlOuyV5EMILv7z8kvcB8IBkDXG2sCjub5ealm5R25gZdJHhQcjmOVuoQOFRYA1T82XSmdTgcxsLo_KE_qjkiIioGeK9Uuf16v8Ry1W-levH_AOHlk9e0ne1DTtmrG21bc0d9MU4dEOucd5PYy2IlEwas17HQa50IC_SMtO-eBvIuJTVrlHxTuFwjPOV1RnUirIBx3xbe60BR6PNlzc2N-hbn4OPdzeahPTd8UREBmHgPgc-iZMo5dJ5gTiBS2KpV5TgUBiRscNfHV8QWVzDJ8lQkNgZiQu490TChxRXNP1TwDSNd5dvXEK9XJbFFZDe3GQZYrSjZ12zYCxjWW4iwcoZsgDT1pvQ2jfT9X7xDZzIrnKMsltQr76-i1s0wVV-pzT3C_kjgdY
link.rule.ids 230,309,786,891,25594,76904
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOKbosYP1CaavTVCGYM9EDO6bkPYRvahvJENRmJiBpEZ_31vDahPvDV3SXO55tfrr727AjwiWUOcLTWK69ulqtbSqN6et-kywY2QLVK2lIXCrqc5sfoy7Uwr8LGrhZF9Qr9lc0RE1BzxXsj9ev13iWXK3MrNU_qOotWzFfVNZcuOGWtqTV0xB30x8U2fK5z341DxAqkrg1mvYyBXOugiKSw77YvXQVmXsv4fVKwTOJzgfHlxCpUsr0ON7_5eq8ORu33yxuEWfZszsPHsRiOfvhmWCMjA98yhZ5MwCmJeJi8QwzNJWPoVNSjyAzIx-MiwBSk_17BJ5AgSGq44hwdLRNyhaNHs1wGzOPxvfvsCqvkqzy6B9BYqSxCjnVbSVTPGEpakKhKslCELUPXWFTT2zXS9X30PNSdyx7Px0BvdwHGpkklSegOqxedXdovhuEjvpBd_ADGBhME
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=DIE-TO-WAFER+BONDING+STRUCTURE+AND+SEMICONDUCTOR+PACKAGE+USING+THE+SAME&rft.inventor=Kang%2C+Unbyoung&rft.inventor=Hong%2C+Jiseok&rft.inventor=Park%2C+Sangcheon&rft.inventor=Kang%2C+Myungsung&rft.inventor=Lee%2C+Hyuekjae&rft.inventor=Hwang%2C+Jihwan&rft.inventor=Kim%2C+Taehun&rft.date=2022-06-09&rft.externalDBID=A1&rft.externalDocID=US2022181285A1