SUBSTRATE PLATING APPARATUS INCLUDING HYBRID PADDLE THAT SIMULTANEOUSLY CIRCULATES AND STIRS PLATING SOLUTION AND REMOVES AIR BUBBLES

• Main Authors: KIM, Jong Uk, IM, Jin Gyu, LEE, Jin Gyu, JUNG, Woon Suk, LEE, Duk Haeng
• Format: Patent
• Language: English
• Published: 02.06.2022
• Subjects: APPARATUS THEREFOR; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Provided is a substrate plating apparatus capable of simultaneously circulating and stirring a plating solution and removing air bubbles. The plating apparatus includes a hybrid paddle disposed in front of a substrate in a plating bath to stir the plating solution. Here, the hybrid paddle includes a spray assembly for spraying the plating solution toward the substrate and a suction assembly for suctioning air bubbles formed on the substrate during plating, and the spray assembly and the suction assembly are coupled into one body and perform a reciprocating movement along a surface of the substrate to stir the plating solution.