OPTICAL INSPECTION OF A WAFER

An image analysis device may align an image to determine a position of a wafer within the image. The wafer may include a plurality of wafer bumps. The image analysis device may mask, based on the position of the wafer, the image to obtain an image of a portion of the wafer. The image analysis device...

Full description

Saved in:
Bibliographic Details
Main Authors PAI, Jiun-Rong, HU, Cheng-Kang, WU, Cheng-Lung, CHEN, Chih-Lieh
Format Patent
LanguageEnglish
Published 19.05.2022
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
PICTORIAL COMMUNICATION, e.g. TELEVISION
TESTING
Online AccessGet full text

Cover

More Information
Summary:An image analysis device may align an image to determine a position of a wafer within the image. The wafer may include a plurality of wafer bumps. The image analysis device may mask, based on the position of the wafer, the image to obtain an image of a portion of the wafer. The image analysis device may binarize the image of the portion of the wafer to create a binarized image of the portion of the wafer. The image analysis device may determine a bump pattern, associated with the plurality of wafer bumps, based on the binarized image of the portion of the wafer. The image analysis device may perform a defect analysis of the determined bump pattern. The defect analysis may be associated with detecting regions of the portion of the wafer in which one or more wafer bumps have abnormal bump heights.
Bibliography:Application Number: US202016949765