PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM

• Main Authors: Kwon, Jin, Lee, Kyu-Cheol
• Format: Patent
• Language: English
• Published: 19.05.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

The present invention provides a photosensitive resin composition capable of forming a cured film having excellent resolution and chemical resistance upon curing at low temperatures and to a cured film prepared therefrom. In the photosensitive resin composition of the present invention, the first copolymer and the second copolymer are used as a binder to introduce appropriate amounts of a succinate group and an epoxy group to the composition. Thus, it is possible to prepare a cured film that can be sufficiently cured even at low temperatures by enhancing the degree of curing and that has excellent resolution through the control of the developability and enhancements in the crosslinking reaction. Further, the composition has enhanced chemical resistance to chemical solvents or cleaning solvents, whereby deformation of the cured film can be prevented.