METHOD OF CONTROLLING THE PLACEMENT OF MICRO-OBJECTS ON A MICRO-ASSEMBLER
Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, posi...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | English |
Published |
19.05.2022
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns. |
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Bibliography: | Application Number: US202217591493 |