NANOWIRE INTERCONNECTS

Interconnects may be formed to an electronic device by creating a strong bond between a wire or lead, one or more nanomaterials, and a contacting area on the electronic device. The creating of the strong bond comprises triggering low power air plasma to activate a surface of the one or more nanomate...

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Bibliographic Details
Main Authors LAO, Yao Y, NEMANICK, Eric Joseph
Format Patent
LanguageEnglish
Published 12.05.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Interconnects may be formed to an electronic device by creating a strong bond between a wire or lead, one or more nanomaterials, and a contacting area on the electronic device. The creating of the strong bond comprises triggering low power air plasma to activate a surface of the one or more nanomaterials forcing the one or more nanomaterials to bond to the surface of the contacting area.
Bibliography:Application Number: US202017092765