ELECTROLESS NICKEL COATINGS AND COMPOSITIONS AND METHODS FOR FORMING THE COATINGS

An aqueous electroless nickel plating bath for forming electroless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer, and is free of a sulfur compound.

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Bibliographic Details
Main Authors Laplante, Jean M, Wojcik, Matthew Joseph, Schaffer, Ambrose
Format Patent
LanguageEnglish
Published 12.05.2022
Subjects
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Summary:An aqueous electroless nickel plating bath for forming electroless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer, and is free of a sulfur compound.
Bibliography:Application Number: US202217585093