CHAMBER CONFIGURATIONS AND PROCESSES FOR PARTICLE CONTROL

Exemplary processing methods may include forming a plasma of a cleaning precursor in a remote region of a semiconductor processing chamber. The methods may include flowing plasma effluents of the cleaning precursor into a processing region of the semiconductor processing chamber. The methods may inc...

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Bibliographic Details
Main Authors Khaja, Abdul Aziz, Prabhakar, Vinay, Balasubramanian, Ganesh, Ha, Sungwon, Wu, Fei
Format Patent
LanguageEnglish
Published 21.04.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
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Summary:Exemplary processing methods may include forming a plasma of a cleaning precursor in a remote region of a semiconductor processing chamber. The methods may include flowing plasma effluents of the cleaning precursor into a processing region of the semiconductor processing chamber. The methods may include contacting a substrate support with the plasma effluents for a first period of time. The methods may include lowering the substrate support from a first position to a second position while continuing to flow plasma effluents of the cleaning precursor. The methods may include cleaning the processing region of the semiconductor processing chamber for a second period of time.
Bibliography:Application Number: US202017071506