SUBSTRATE PROCESSING TOOL CAPABLE OF MODULATING ONE OR MORE PLASMA TEMPORALLY AND/OR SPATIALLY

• Main Authors: CHEN, Lee, SAKIYAMA, Yukinori, LEESER, Karl Frederick
• Format: Patent
• Language: English
• Published: 21.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A plasma tool in which the generation of two or more plasmas in a processing chamber used for processing a substrate is modulated either temporally, spatially, or both. The modulation of the two plasmas is used for the formation of Diamond Like Carbon (DLC) layers on substrates. One plasma is used for forming an amorphous carbon layer, while the second plasma is used for converting the amorphous carbon layer to a DLC by ion bombardment.